Key DFM strategies include optimizing trace widths and spacing to match the fabrication capabilities for heavy copper layers, ensuring adequate annular rings to withstand mechanical stress, and implementing symmetrical stack-ups to prevent board warping during thermal cycling. Furthermore, proper component placement and the inclusion of fiducial marks facilitate precise automated assembly and rigorous quality inspection. Adhering to strict DFM guidelines significantly reduces fabrication defects, lowers overall production costs, and guarantees the high reliability required for mission-critical Industrial Electronics operating in harsh environments.